Recently, in order to fully utilize the performance of the third and fourth generation Xeon processors, Intel, PowerLeader, and Envicool jointly launched the first liquid cooled aluminum cold plate system compatible with multiple platforms.

The liquid cooled aluminum cold plate system is compatible with third-generation, fourth, fifth, and sixth generation Xeon processor solutions, and has been validated through actual operation on the Eagle Stream platform in the project, fully meeting standardized batch delivery and large-scale commercial conditions, paving the way for future large-scale applications of liquid cooled servers and data centers.

The aluminum cold plate system jointly developed by Intel, Baode, and Envicool has passed a series of rigorous long-term operation tests, including conductivity, ion, colony, thermal resistance, flow resistance, etc. Its performance is comparable to copper cold plates on the same platform in all aspects, and it has significant advantages in low thermal resistance, small temperature difference, and low flow resistance.

The cold plate liquid cooling system includes components such as cold plates, leakage detection, quick couplings, manifolds, liquid cooled CDUs, liquid cooled working fluids, and cold sources. Among them, the cold plate is a component that indirectly contacts the chip and enhances heat dissipation through internal customized liquid microchannels. Considering the requirements for corrosion resistance, craftsmanship, and other aspects, ordinary cold plate systems on the market generally use copper materials.

As a common radiator material, aluminum has the characteristics of lightweight structure, flexible process, and significant economic advantages. Therefore, the development and application of high-performance aluminum cold plate systems can help promote the application of liquid cooling technology and assist in the low-carbon and sustainable development of the computing power industry.

The research and manufacturing of high-performance aluminum systems require a series of technical challenges to be solved, requiring relevant suppliers to have positive research and development capabilities, master key technologies, and have rich experience in research and development, manufacturing, testing, and delivery. The joint launch of the aluminum cold plate system by Intel, PowerLeader, and Envicool is not only the result of in-depth cooperation among the three parties, but also reflects their high recognition of each other's professional strength.

Envicool maintains deep cooperative relationships with well-known companies in the server field such as Intel and PowerLeader. For example, Envicool has collaborated with industry experts such as Intel to release white papers, develop revised standards, and provide full chain liquid cooling technical support for PowerLeader liquid cooled servers.

As the first supplier in the industry to launch a full chain liquid cooling solution, Envicool actively participates in the development of industry standards and promotes the large-scale application of liquid cooling technology. So far, Envicool has achieved the delivery of over 900MW liquid cooling projects.

Deeply cultivating professional fields, continuously creating value, and winning long-term trust from customers, Envicool takes "managing every degree well" as its mission, continuously empowering customers with professional temperature control technology, and providing strong support for computing power to become a new quality productivity!

During long-term operation testing, it can be observed through a microscope that the aluminum cold plate fins are in good condition.